Diagnose integrator-, gain-, and slice-thickness-dependent abnormalities
When a DAS-side image fault has been narrowed down but not yet explained, three source-stated dependency patterns tell you exactly where in the acquisition chain to keep looking: which views are bad points at one of two integrators, which GAIN numbers are bad — and whether it's odd/even-only or every view — points at a specific gain circuit, and which image row is bad points at a specific detector element by way of the slice-thickness element selection table (source 2D201-065, §5.4.4-5.4.6, p.84-85).
Applies to
Aquilion 16 (TSX-101A) — data acquisition section (DAS), source volume 2D201-065, §5.4.4-5.4.6 (p.84-85). Sits immediately after the four symptom-specific fault-isolation flowcharts (Figures 5.4-18 to 5.4-21, p.80-83) and the trouble-cause matrix (Table 5.4-2, p.79) — see Related. This section explains WHY certain DAS fault patterns look the way they do (which views, which gains, which image row are affected), rather than adding a new flowchart of its own.
Personnel
1 technician · Intermediate — reading the E19 field of a DCA dump to tell whether only odd or only even views are abnormal, distinguishing a per-integrator gain-circuit fault (specific GAIN numbers, odd/even views only) from a shared gain-circuit fault (all views), and cross-referencing an abnormal image row against the slice-thickness element selection table to identify which detector element is implicated (skill assessment derived from section content — not an OEM-stated skill level).
Steps
4 steps
Source
2D201-065E*D p.84-85
Full step-by-step for Diagnose integrator-, gain-, and slice-thickness-dependent abnormalities
All 4 steps are documented in the FSELIB Aquilion 16 (TSX-101A) service manual — re-authored, web-first, with the real figures from the source.